Translate into other Languages

Thursday 21 February 2013

ASUS Announced World's First AMD based Motherboard with PCI Express 3.0


Asus announced the TUF series SABERTOOTH 990FX/GEN3 R2.0, the world's first AMD based motherboard to feature PCI Express 3.0 for use with next generation
high performance graphics cards. Up to three DirectX 11 graphics cards with 28nm GPU technology can be used via NVIDIA SLI or AMD CrossFireX to create desktop PCs
with formidable graphics performance.
                 SABERTOOTH 990FX/GEN3 R2.0 also features renowned ASUS TUF Series thermal design for superior heat removal. It undergoes military and server grade
testing to ensure absolute stability, reliability and longevity SABERTOOTH 990FX/GEN3 R2.0 is backed by a five year warranty.

Military grade components for superior reliability
             SABERTOOTH 990FX/GEN3 R2.0 meets strict TUF series quality assurance standards, which consists of multiple stage military and server-grade tests. TUF-certified
alloy chokes, together with solid state capacitors and MOSFETs, ensure complete reliability even when the motherboard is subjected to intense use for prolonged periods.
Four DIMM slots support uo to 32GB DDR3 memory at frequencies up to 2400MHz, aided by an eight layered PCB that promotes faster memory performance while
ensuring stability and compatibility with improved cross-component signal quality.

Sophisticated thermal management copes with extreme heat
          TUF series motherboards are designed to provide absolute stability and reliability under harsh operating conditions, and feature sophisticated thermal management
to handle extreme heat. Both the Northbridge and Southbridge use dual-heatpipe heat sinks with CeraMIX micro ridged coating that increases the effective heat dissipation surface area
by around 50%.
          SABERTOOTH 990FX/GEN3 R2.0 also features TUF thermal Radar, which uses multiple heat sensors across the motherboard for real time temperature monitoring.
Independent and automatic fan speed control then allows components to be cooled individually for maximum efficiency and operating stability.

No comments:

Post a Comment